Interflux® LMPA™-Q6 is a no-clean solder paste with the high reliability LMPA™-Q low melting point alloy.
LMPA™ -Q6 solder paste has improved printing stability, stencil life and more transparent residue compared to DP 5600.
RO L0 to IPC and EN standards.
Halide content 0,00%

Interflux® DP 5600是一款低熔点的免清洗锡膏，合金成分SnBi(Ag)
RO/L0
卤素含量：0.00%
Sn42Bi57Ag1(熔点139℃—282℉)

Interflux® LP 5720 is a no-clean solder paste with optimized printing stability and transparent residue after reflow, in lead-free and SnPb(Ag) alloys.
LP 5720 is the successor of DP 5505.
RO L0 to IPC and EN standards.
Halide content 0,00%

Interflux® DP 5505 是基于较高稳定性的免清洗锡膏
低空洞
减少虚焊
RO/L0
卤素含量：0.00%

Interflux® µ-dIFe 7 是一款为浸焊设计的免清洗无铅锡膏
可保持锡膏用量一致，并且可根据需求对区域进行选择性涂覆
简单快速
降低连桥风险
与Ersa Dip&Print Station匹配度较高
适用于BGA，J型及翼型ICs
RO/L0
卤素含量：0.00%

Interflux® IF 9009LT 是一款具有较高活性的免清洗助焊剂，有有铅和无铅两种类型
使用于退化或较难焊接的情况
RE L1