Products for wave soldering

Interflux^® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.

OR L0 according to EN and IPC standards

Interflux^® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.

Interflux^® PacIFic 2010F is a water based no-clean soldering flux for foam fluxing applications. PacIFic 2010F provides low residues after soldering.

Interflux^® AF 4818 PbF is a solvent based, rosin containing, no-clean soldering flux with increased solid content and a large process window.
It provides increased chances to pass harsh environmental tests as sometimes required in the automotive industry.

Interflux^® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M provides.
IF 2005K is preferred for lead-free wave soldering but is also suitable for selective soldering and SnPb wave soldering.

PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels after soldering with reduced micro solder ball formation.

PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.

Solder rods are ø 5mm X +/- 320mm (+/- 52g) pieces of LMPA-Q solder alloy in a 15kg box.

Interflux^® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag), lead-free and LMPA-Q alloys.

Interflux^® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.

Solder stones are convexly shaped pieces of LMPA-Q solder with dimensions of +/- d:37mm and H: 15mm for easy solder bath filling. The standard package is a 2,5kg plastic jar.

Interflux^® IF 910 de-oxidation oil separates oxides from good solder in a solder bath. It can drastically reduce the solder consumption.

LMPA-Oil is a maintenance oil for the non wettable parts of soldering nozzles and for pump shafts when using the LMPA-Q low melting point soldering alloy in wave or selective soldering machines. LMPA-Oil will inhibit the solder to adhere to the surfaces and cause obstruction of the solder flow.

Interflux^® IF 710 PSM is a natural latex based, fast curing peelable solder mask. To shield areas on a PCB from flux and solder wave contact.

Interflux^® Anti-oxidant pellets minimize the formation of oxides on lead-free and SnPb(Ag) solder baths. Used as an addition in the solder bath.
The product is not recommended to be used in closed nitrogen machines nor in combination with Ni-doped soldering alloys.

The InterSpray Curve series are designed to retrofit all existing soldering machines with a reliable spray fluxer which offers excellent results. The InterSpray Curve 2 double nozzle series are designed to use 2 different types of fluxes in 1 reliable spray fluxer system.