Soldering fluxes
Alcohol-based soldering fluxes
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IF 2005M
Interflux® IF 2005M is the internationally renowned resin- and rosin-free, no-clean / No-residue™ flux standard.
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IF 2005K
Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M provides.
IF 2005K is preferred for lead-free wave soldering but is also suitable for selective soldering and SnPb wave soldering. -
IF 2005C
Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.OR L0 according to EN and IPC standards
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OSPI 3311M
Interflux® OSPI 3311M is an alcohol based no-clean flux for soldering OSP finished boards that have passed one or more reflow cycles. OSPI 3311M provides optimised through hole fill on degraded OSP finishes.
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OSPI 3311
OSPI 3311 has been replaced by OSPI 3311M.
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IF 2005
IF 2005 has been replaced by IF 2005M.
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IF 2005-2,5%
IF 2005-2,5% has been replaced by IF 2005K.
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Tarnex 10
Interflux® Tarnex 10 is a highly activated alcohol based flux with water soluble residues for tinning of tarnished, heavily oxidized or hard to solder surfaces. The residues after soldering must be cleaned with water. Tarnex 10 has been specifically designed for dip soldering operations. Due to its activity level, Tarnex 10 is not recommended for soldering electronics.
Tarnex 10 is only available on request. -
TS 15
TS 15 has been replaced by IF 2005M.
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TS 18
TS 18 has been replaced by IF 2005M.
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TS 33
TS 33 has been replaced by IF 2005C.
Low VOC soldering fluxes
VOC-free soldering fluxes
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SelectIF 2040
Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.
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PacIFic 2009M
Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave soldering but also for selective soldering and tinning. PacIFic 2009M has a long history of use in virtually all electronic branches worldwide.
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PacIFic 2009MLF
PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
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PacIFic 2009MLF-E
PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels after soldering with reduced micro solder ball formation.
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PacIFic 2010F
Interflux® PacIFic 2010F is a water based no-clean soldering flux for foam fluxing applications. PacIFic 2010F provides low residues after soldering.
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PacIFic 2011F
PacIFic 2011F has been replaced by PacIFic 2009M.
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PacIFic 2007
PacIFic 2007 has been replaced by PacIFic 2009M.
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WSF 1100
Interflux ® WSF 1100 is a VOC-free, absolutely halide free soldering flux with low corrosion water soluble residues after soldering. The residues of WSF 1100 need to be cleaned
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PacIFic 2008
PacIFic 2008 has been replaced by PacIFic 2009M.
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WSF 7700
Interflux ® WSF 7700 is a VOC-free, absolutely halide free soldering flux with low corrosion water soluble residues after soldering. The residues of WSF 7700 need to be cleaned
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PacIFic 2008plus
PacIFic 2008plus has been replaced by PacIFic 2009M.
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PacIFic 2009
PacIFic 2009 has been replaced by PacIFic 2010F.
Rosin-based soldering fluxes
Rework & repair soldering fluxes
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IF 8001
Interflux® IF 8001 is a solvent based, no-clean soldering flux with low residue formation for selective fluxing applications, typically used in hand soldering and rework and repair.
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IF 6000
Interflux® IF 6000 is a rosin containing, no-clean soldering flux with increased process window for selective fluxing applications, typically used in hand soldering and rework and repair.
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TerrIFic RP65
TerrIFic RP65 is a no-clean water based soldering flux for selective fluxing applications, typically used in hand soldering and rewok and repair.
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IF 8300
Interflux® IF 8300 is a no-clean, halide-free tacky gel flux suitable for reballing and BGA rework.
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IF 7500 HAB
Interflux® IF 7500HAB is a no-clean, halide-free tacky gel flux with increased process window. Suitable for reballing and BGA rework.
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RA 25015
Interflux® RA25015 is an activated rosin based no-clean soldering flux. RA25015 can be used for surfaces with poor solderability. RA25010 is lower activated and RA25050 is more activated than RA25015.
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RA 25010
Interflux® RA25010 is an activated rosin based no-clean soldering flux. RA25010 can be used for surfaces with poor solderability. RA25015 and RA25050 are more activated than RA25010.
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RA 25050
Interflux® RA25050 is an activated rosin based no-clean soldering flux. RA25050 can be used for surfaces with poor solderability. RA25010 and RA25015 are less activated than RA25050.
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RA 38053
Interflux® RA 38053 is an activated rosin based dipping flux that gives good adhesion to the surfaces to be soldered.
Flux thinners
Other
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LMPA-S
Interflux® LMPA™-S is an absolutely halide free no-clean soldering flux designed to reduce micro solder balling on solder ball sensitive solder masks when selective soldering with the low melting point alloy LMPA™-Q.
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IF FL5821
Interflux® IF FL5821 is a highly activated flux with water soluble residues that must be cleaned with water after soldering. IF FL5821 can be used for tinning of surfaces with very poor solderability. Due to its activity level, IF FL5821 is not recommended for soldering electronics.
IF FL5821 is only available on request.