All products

Interflux^® T 2005M is the designated thinner for the IF 2005-series of fluxes. Flux thinning is typically done in open flux systems that involve evaporation of the flux solvent like in foam fluxing.

Interflux^® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M provides.
IF 2005K is preferred for lead-free wave soldering but is also suitable for selective soldering and SnPb wave soldering.

Interflux^® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean soldering flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
IF 2005C is preferred for selective soldering but can be used for wave and dip soldering too.

OR L0 according to EN and IPC standards

PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.

PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels after soldering with reduced micro solder ball formation.

Interflux^® PacIFic 2010F is a water based no-clean soldering flux for foam fluxing applications. PacIFic 2010F provides low residues after soldering.

Interflux^® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.

Interflux^® AF 4818 PbF is a solvent based, rosin containing, no-clean soldering flux with increased solid content and a large process window.
It provides increased chances to pass harsh environmental tests as sometimes required in the automotive industry.

Interflux^® IF 6000 is a rosin containing, no-clean soldering flux with increased process window for selective fluxing applications, typically used in hand soldering and rework and repair.

TerrIFic RP65 is a no-clean water based soldering flux for selective fluxing applications, typically used in hand soldering and rewok and repair.

Interflux^® IF 8300 is a no-clean, halide-free tacky gel flux suitable for reballing and BGA rework.

Interflux^® IF 7500HAB is a no-clean, halide-free tacky gel flux with increased process window. Suitable for reballing and BGA rework.

Several Interflux^® fluxes are available in a flux pen. The refillable flux pen has a very fine glass fibre tip that allows flux application only on the solder joint which avoids flux residue in the surrounding area giving esthetically clean soldering results. The non refillable flux pen is more economic.
Standard fluxes that are available in the flux pen: IF 8001, IF 6000, TerrIFic RP 65, IF 2005M, IF 2005C.

Interflux^® IF 9009LT is a no-clean solder paste with increased activity in both SnPb(Ag) and lead-free alloys.

Interflux^® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications

The LMPA-Q hand soldering kit can be used for applications where slow soldering or poor through hole fill with Sn (Ag)Cu alloys are a problem. The hand soldering process with the kit will be faster and through hole fill much easier.

Interflux^® IR 3 is an absolutely halide-free, lead-free, no-clean solder wire that has been developed for robot soldering. It provides low spattering, fast wetting, low soldering tip contamination and low residue. IR 3 can also be used for laser and hand soldering with the same advantages.

Interflux^® QF 70 is an absolutely halide-free, no-clean lead-free solder wire with fast wetting for fast soldering operations. QF 70 can be used in both hand soldering and automated soldering processes.

Interflux^® Flexsol 903 is an absolutely halide-free, no-clean solder wire with reduced spattering properties in lead-free alloys.
RO L0 to EN and IPC standards
Flux content: 2,2% and 3,5%

Interflux^® Aquasol 4018 is a high activity solder wire with water soluble residues in SnPb and lead-free alloys. Very good wetting ability on surfaces with poor solderabilty. Residues must be cleaned.
Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F).
 OR H1 to EN and IPC standards
 Flux content: 2,5%

Interflux^® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.

Solder stones are convexly shaped pieces of LMPA-Q solder with dimensions of +/- d:37mm and H: 15mm for easy solder bath filling. The standard package is a 2,5kg plastic jar.

Interflux^® plain solder wire for automatic solder feeding on selective soldering systems in lead-free and SnPb(Ag) alloys and in the LMPA-Q alloy. Standard diameters are 2mm and 3mm on a 4kg role.

Interflux^® Solder Bars are made from high purity, low oxidation metals in SnPb(Ag), lead-free and LMPA-Q alloys.

Solder rods are ø 5mm X +/- 320mm (+/- 52g) pieces of LMPA-Q solder alloy in a 15kg box.

Interflux^® IF 710 PSM is a natural latex based, fast curing peelable solder mask. To shield areas on a PCB from flux and solder wave contact.

Interflux^® ISC 8020 is a stencil cleaning liquid for the removal of solder paste and uncured SMT adhesives in stencil printers. ISC 8020 has been designed not to interfere with solder paste rheology.

LMPA-Oil is a maintenance oil for the non wettable parts of soldering nozzles and for pump shafts when using the LMPA-Q low melting point soldering alloy in wave or selective soldering machines. LMPA-Oil will inhibit the solder to adhere to the surfaces and cause obstruction of the solder flow.

Interflux^® pre-saturated stencil clean wipes in flip-top tubs and refill bags for the removal of solder paste and non cured SMT adhesive from stencils and tools.

Interflux^® Tip Tinner cleans and retins tips of soldering irons. The regular use of Tip Tinner can substantially prolong soldering tip life.

Interflux^® IF 910 de-oxidation oil separates oxides from good solder in a solder bath. It can drastically reduce the solder consumption.

Interflux^® pre-saturated IPA/DI wipes in flip-top tubs and refill bags for general cleaning of surfaces.

Interflux^® Anti-oxidant pellets minimize the formation of oxides on lead-free and SnPb(Ag) solder baths. Used as an addition in the solder bath.
The product is not recommended to be used in closed nitrogen machines nor in combination with Ni-doped soldering alloys.

The InterSpray Curve series are designed to retrofit all existing soldering machines with a reliable spray fluxer which offers excellent results. The InterSpray Curve 2 double nozzle series are designed to use 2 different types of fluxes in 1 reliable spray fluxer system.