Alcohol-
basedSoldering fluxes
based
OSPI 3311M
NEW
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Alcohol based flux
-
For wave soldering
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Absolutely halide-free
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High deoxidation power
-
For soldering OSP
Interflux® OSPI 3311M is an alcohol based no-clean flux for soldering OSP finished boards that have passed one or more reflow cycles.
Interflux® OSPI 3311M is an alcohol based no-clean flux for soldering OSP finished boards that have passed one or more reflow cycles.
For lead-free and SnPb processes
OR L0 according to EN and IPC standards
Halide content: 0,00%
IF 2005M
-
Alcohol based
-
For wave soldering
-
Absolutely halide-free
-
High compatibility with conformal coating
-
No-residue ™
Interflux® IF 2005M is the internationally renowned resin- and rosin-free, no-clean / No-residue™ flux standard.
Interflux® IF 2005M is the internationally renowned resin- and rosin-free, no-clean / No-residue™ flux standard.
Interflux® IF 2005M is QPL- listed (approved to MIL-F-14256F).
SnPb and lead-free compatible
Suitable for spray and foam fluxing
OR L0 to EN and IPC standards
Solid content: 1,85% ±0,15
Halide content: 0,00%
IF 2005K
-
Alcohol based
-
For wave soldering
-
Absolutely halide-free
-
High compatibility with conformal coating
-
Low residue
Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M provides.
Interflux® IF 2005K with 2,5% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M provides.
SnPb and lead-free compatible
Suitable for spray and foam fluxing
OR L0 according to EN and IPC standards
Solid content: 2,5% ±0,3
Halide content: 0,00%
IF 2005C
-
Alcohol based
-
For selective soldering
-
For pre-tinning
-
Absolutely halide-free
-
High deoxidation power
-
Long preheat resistant
-
High compatibility with conformal coating
Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
Interflux® IF 2005C with 3,3% of solids is a resin- and rosin-free, no-clean flux. It can be used when the soldering process needs more activation than IF 2005M or IF 2005K provide.
SnPb and lead-free compatible
Suitable for spray and foam fluxing
OR L0 according to EN and IPC standards
Solid content: 3,3% ± 0,3
Halide content: 0,00%
VOC-freeSoldering fluxes
SELECTIF 2040
NEW
-
Water based flux
-
For selective soldering
-
Absolutely halide-free
-
High deoxidation power
-
High temperature resistant
-
High compatibility with conformal coating
-
Low residue
Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.
Interflux® SelectIF 2040 is a water based no-clean selective soldering flux with a wide process window and low residue formation.
Withstands high process temperatures and long process times.
For SnPb and lead-free processes
OR L0 according to EN and IPC standards
Solid content: 6,5% ±0,2
Halide content: 0,00%
PACIFIC 2009M
-
Water based flux
-
For wave soldering
-
For selective soldering
-
For pre-tinning
-
For spray fluxing
-
Absolutely halide-free
-
High compatibility with conformal coating
-
Low residue
Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave and selective soldering.
Interflux® PacIFic 2009M is a water based no-clean flux mainly used for wave and selective soldering.
For SnPb and lead-free processes
OR L0 according to EN and IPC standards
Solid content: 3,7% ±0,15
Halide content: 0,00%
PACIFIC 2009MLF
-
Water based flux
-
For wave soldering
-
For selective soldering
-
For spray fluxing
-
Absolutely halide-free
-
Anti solder ball formation
PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
PacIFic 2009MLF is a water based no-clean soldering flux developed to minimize micro solder ball formation.
For SnPb and lead-free processes
Main field of use: wave soldering and selective soldering
OR L0 according to EN and IPC standards
Solid content: 3,6% ±0,2
Halide content: 0,00%
PACIFIC 2009MLF-E
-
Water based flux
-
For wave soldering
-
For spray fluxing
-
Absolutely halide-free
-
Reduced residue
-
Reduced solder ball formation
PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels with reduced micro solder ball formation.
PacIFic 2009MLF-E is a water based no-clean flux which combines low residue levels with reduced micro solder ball formation.
For SnPb and lead-free processes
Main field of use: wave soldering
OR L0 according to EN and IPC standards
Solid content: 3,6% ±0,25
Halide content: 0,00%
PACIFIC 2010F
-
Water based flux
-
For wave soldering
-
For spray fluxing
-
For foam fluxing
-
Absolutely halide-free
-
High compatibility with conformal coating
-
Low residue
PacIFic 2010F is a water based no-clean flux for foam fluxing applications.
PacIFic 2010F is a water based no-clean flux for foam fluxing applications.
For SnPb and lead-free wave soldering
OR L0 according to EN and IPC standards
Solid content: 2,5% ±0,15
Halide content: 0,00%
Low VOCSoldering fluxes
IF 3006
-
Low VOC
-
For wave soldering
-
For selective soldering
-
For pre-tinning
-
Absolutely halide-free
-
High compatibility with conformal coating
Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
Interflux® IF 3006 is a resin- and rosin free, no-clean soldering flux with a reduced VOC content.
For SnPb and lead-free processes
Also for pre-tinning
OR L0 according to EN and IPC standards
Solid content: 3,2% ±0,4
Halide content: 0,00%
Rosin-
basedSoldering fluxes
based
AF 4818 PBF
-
Contains rosin
-
Alcohol based
-
For wave soldering
-
For spray fluxing
-
Absolutely halide-free
-
High deoxidation power
-
Long preheat resistant
Interflux® AF 4818 PbF is a solvent based, rosin containing, no-clean soldering flux with increased solid content and a large process window.
Interflux® AF 4818 PbF is a solvent based, rosin containing, no-clean soldering flux with increased solid content and a large process window.
For SnPb and lead-free wave soldering processes
RO L0 according to EN and IPC standards
Solid content: 5%
Halide content: 0,00%
Rework & RepairSoldering fluxes
IF 8300 SERIES
-
For rework & repair
-
For reflow soldering
-
For dispensing
-
For stencil printing
-
For dipping
-
Absolutely halide-free
-
Low residue
Interflux® IF 8300 is a no-clean, halide-free tacky gel flux.
Interflux® IF 8300 is a no-clean, halide-free tacky gel flux.
For SnPb and lead-free processes
Suitable for reballing and BGA rework
RE L0 to EN and IPC standards
Halide content: 0,00%
3 different viscosities:
IF 8300 : 210 kcps
IF 8300-4 : 70 kcps
IF 8300-6 : 25 kcps
IF 7500HAB
-
For rework & repair
-
For reflow soldering
-
For dispensing
-
For stencil printing
-
For dipping
-
Absolutely halide-free
-
Long profile resistant
-
High deoxidation power
-
Contains rosin
Interflux® IF 7500HAB is a no-clean, halide-free tacky gel flux with increased process window.
Interflux® IF 7500HAB is a no-clean, halide-free tacky gel flux with increased process window.
For SnPb and lead-free processes
Suitable for reballing and BGA rework
RO M0 to EN and IPC standards.
Halide content: 0,00%
Viscosity: 200 kcps
IF 8001
-
Alcohol based flux
-
For rework & repair
-
Absolutely halide-free
-
Low residue
Interflux® IF 8001 is a solvent based, no-clean soldering flux with low residue formation for selective fluxing applications.
Interflux® IF 8001 is a solvent based, no-clean soldering flux with low residue formation for selective fluxing applications.
For SnPb and lead-free processes
Main field of use: hand soldering. Other fields of use: automated soldering, stamp soldering, etc...
RE L0 to EN and IPC standards
Halide content: 0,00%
IF 8001 is available in refillable and non refillable flux pens.
IF 6000
-
Alcohol based
-
For rework & repair
-
Absolutely halide-free
-
Contains rosin
-
High deoxidation power
-
Long preheat resistant
Interflux® IF 6000 is a rosin containing, no-clean soldering flux with increased process window for selective fluxing applications.
Interflux® IF 6000 is a rosin containing, no-clean soldering flux with increased process window for selective fluxing applications.
For SnPb and lead-free processes
Main field of use: hand soldering. Other fields of use: automated soldering, stamp soldering, BGA rework, wafer bumping, etc...
RO L0 to EN and IPC standards
Halide content: 0,00%
IF 6000 is available in refillable and non refillable flux pens.
TERRIFIC RP65
-
Water based flux
-
For rework & repair
-
Absolutely halide-free
-
Long preheat resistant
TerrIFic RP65 is a water based, no-clean soldering flux for selective fluxing applications.
TerrIFic RP65 is a water based, no-clean soldering flux for selective fluxing applications.
For SnPb and lead-free processes
Main field of use: hand soldering. Other fields of use: automated soldering, stamp soldering, etc...
OR L0 to EN and IPC standards
Halide content: 0,00%
TerrIFic RP 65 is available in refillable and non refillable flux pens.
FLUX THINNERS
T 2005M
-
Alcohol based
-
Absolutely halide-free
-
For the IF 2005-series fluxes
Interflux® T 2005M is the thinner / conditioner for the IF 2005-series fluxes.
Interflux® T 2005M is the thinner / conditioner for the IF 2005-series fluxes.
When used in foam fluxing or other open flux applications.
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CONTACT
INTERFLUX
HEADQUARTERS
INTERFLUX
HEADQUARTERS
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Gent zeehaven 3170A
Eddastraat 51
9042 Gent
BELGIUM
Tel.: +32 9251 4959
Fax: +32 9251 4970
info@interflux.com
CONTACT
INTERFLUX WORLDWIDE
INTERFLUX WORLDWIDE
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