SOLDERING FLUXESfor rework & repair
IF 8300 SERIES
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For rework & repair
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For reflow soldering
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For dispensing
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For stencil printing
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For dipping
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Absolutely halide-free
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Low residue
Interflux® IF 8300 is a no-clean, halide-free tacky gel flux.
Interflux® IF 8300 is a no-clean, halide-free tacky gel flux.
For SnPb and lead-free processes
Suitable for reballing and BGA rework
RE L0 to EN and IPC standards
Halide content: 0,00%
3 different viscosities:
IF 8300 : 210 kcps
IF 8300-4 : 70 kcps
IF 8300-6 : 25 kcps
IF 7500HAB
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For rework & repair
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For reflow soldering
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For dispensing
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For stencil printing
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For dipping
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Absolutely halide-free
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Long profile resistant
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High deoxidation power
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Contains rosin
Interflux® IF 7500HAB is a no-clean, halide-free tacky gel flux with increased process window.
Interflux® IF 7500HAB is a no-clean, halide-free tacky gel flux with increased process window.
For SnPb and lead-free processes
Suitable for reballing and BGA rework
RO M0 to EN and IPC standards.
Halide content: 0,00%
Viscosity: 200 kcps
IF 8001
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Alcohol based flux
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For rework & repair
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Absolutely halide-free
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Low residue
Interflux® IF 8001 is a solvent based, no-clean soldering flux with low residue formation for selective fluxing applications.
Interflux® IF 8001 is a solvent based, no-clean soldering flux with low residue formation for selective fluxing applications.
For SnPb and lead-free processes
Main field of use: hand soldering. Other fields of use: automated soldering, stamp soldering, etc...
RE L0 to EN and IPC standards
Halide content: 0,00%
IF 8001 is available in refillable and non refillable flux pens.
IF 6000
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Alcohol based
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For rework & repair
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Absolutely halide-free
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Contains rosin
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High deoxidation power
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Long preheat resistant
Interflux® IF 6000 is a rosin containing, no-clean soldering flux with increased process window for selective fluxing applications.
Interflux® IF 6000 is a rosin containing, no-clean soldering flux with increased process window for selective fluxing applications.
For SnPb and lead-free processes
Main field of use: hand soldering. Other fields of use: automated soldering, stamp soldering, BGA rework, wafer bumping, etc...
RO L0 to EN and IPC standards
Halide content: 0,00%
IF 6000 is available in refillable and non refillable flux pens.
TERRIFIC RP65
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Water based flux
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For rework & repair
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Absolutely halide-free
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Long preheat resistant
TerrIFic RP65 is a water based, no-clean soldering flux for selective fluxing applications.
TerrIFic RP65 is a water based, no-clean soldering flux for selective fluxing applications.
For SnPb and lead-free processes
Main field of use: hand soldering. Other fields of use: automated soldering, stamp soldering, etc...
OR L0 to EN and IPC standards
Halide content: 0,00%
TerrIFic RP 65 is available in refillable and non refillable flux pens.
SOLDER PASTESfor rework & repair
µ-DIFE 7
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For reflow soldering
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For rework & repair
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For dipping
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Absolutely halide-free
Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications.
Interflux® µ-dIFe 7 is a no-clean, lead-free solder paste for dipping applications.
Repeatable and selective paste volume
Fast and easy application
Reduced risk of bridging on μ-BGAs
Suitable for the ERSA Dip&Print Station
For Ball Grid Arrays, J-lead and Gull Wing ICs
RO L0 to EN and IPC standards
Halide content: 0,00%
SOLDER WIRESfor rework & repair
QF 70
NEW
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Increased wetting speed
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Transparent residue
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Absolutely halide-free
Interflux® QF 70 is an absolutely halide-free, rosin based no-clean solder wire with fast wetting for fast soldering operations in lead-free alloys.
Interflux® QF 70 is an absolutely halide-free, rosin based no-clean solder wire with fast wetting for fast soldering operations in lead-free alloys.
QF 70 can be used in both hand soldering and auto-mated soldering processes
RO L0 to IPC and EN standards.
Halide content 0,00%
NH 1
NEW
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Increased wetting ability, increased wetting speed
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Low spattering
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Colophony free
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Low transparent residue
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High repeatability
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Perfect for laser soldering
Interflux® NH 1 is a no-clean colophony free activated solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass, in lead-free alloys.
Interflux® NH 1 is a no-clean colophony free activated solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass, in lead-free alloys.
NH 1 can be used in both hand soldering and auto-mated soldering processes
RE L1 to IPC and EN standards.
RosIX 705
NEW
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Increased wetting ability
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Non disturbing smell
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High repeatability
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Smooth transparent residue
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Suitable for robot soldering
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in lead-free alloys.
Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in lead-free alloys.
RosIX 705 can be used on surfaces that are difficult
to solder, e.g. OSP, Ni, Zn, brass, German silver, etc.. as well
as on degraded and oxidized surfaces.
RO L1 to IPC and EN standards.
RosIX 705 SnPb(Ag)
NEW
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Increased wetting ability
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Non disturbing smell
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High repeatability
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Smooth transparent residue
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Suitable for robot soldering
Interflux® RosIX 705 SnPb(Ag) is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in SnPb(Ag) alloys.
Interflux® RosIX 705 SnPb(Ag) is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in SnPb(Ag) alloys.
RosIX 705 SnPb(Ag) can be used on surfaces that are difficult to solder, e.g. OSP, Ni, Zn, brass, German silver,... as well as on degraded and oxidized surfaces.
RO L1 to IPC and EN standards.
AQUASOL 4018
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Water soluble solder wire
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Lead-free solder wire
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For rework & repair
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Absolutely colophony free
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High activity
Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in lead-free alloys.
Interflux® Aquasol 4018 is a high activity solder wire with water soluble residues in lead-free alloys.
Very good wetting ability on surfaces with poor solderabilty
Residues must be cleaned
Residues can be cleaned with DI water at 35°C-45°C (95°F— 114°F)
OR H1 to EN and IPC standards
Flux content: 2,5%
IF 14 SERIES LEAD-FREE
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Lead-free solder wire
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For rework & repair
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Brushable residue
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Absolutely halide-free
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Absolutely colophony free
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Low residue
Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in lead-free and SnPb(Ag) alloys.
Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in lead-free and SnPb(Ag) alloys.
Residues brushable by hand
RE L0 to EN and IPC standards
Lead-free : IF 14-16 and IF 14-22 (1,6% and 2,2% of flux content)
SnPb(Ag) : 0,6%, 0,9%,1,0% and 1,4% of flux content
IF14 SERIES SnPb(Ag)
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SnPb(Ag) solder wire
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For rework & repair
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Brushable residue
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Absolutely halide-free
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Absolutely colophony free
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Low residue
Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in SnPb(Ag) and lead-free alloys.
Interflux® IF 14 series are colophony free, absolutely halide-free, no-clean solder wires with easily removable residues in SnPb(Ag) and lead-free alloys.
Residues brushable by hand
RE L0 to EN and IPC standards
SnPb(Ag) : IF 14-06, IF 14-09, IF 14-10, IF14-14 (0,6%, 0,9%,1,0% and 1,4% of flux content)
Lead-free : 1,6% and 2,2% of flux content
FLEXSOL 903
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Lead-free solder wire
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For rework & repair
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Colophony containing
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Absolutely halide-free
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Low spattering
Interflux® Flexsol 903 is an absolutely halide-free, no-clean solder wire with reduced spattering properties in lead-free alloys.
Interflux® Flexsol 903 is an absolutely halide-free, no-clean solder wire with reduced spattering properties in lead-free alloys.
RO L0 to EN and IPC standards.
Flux content: 2,2% and 3,5%
AUXILIARIESfor rework & repair
TIP TINNER
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For rework & repair
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For SnPb(Ag) processes
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For lead-free processes
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Absolutely halide-free
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Colophony free
Interflux® Tip Tinner cleans and retins tips of soldering irons.
Interflux® Tip Tinner cleans and retins tips of soldering irons.
Increases tip life substantially
Absolutely halide-free
Non abrasive
PURGEL
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For rework & repair
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For dispensing
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Approved for MYDATA MY 500
Interflux® Purgel is a neutral cleaner/conditioner for pumps and valves of dispensing systems.
Interflux® Purgel is a neutral cleaner/conditioner for pumps and valves of dispensing systems.
For preserving dispensing system parts when not in use.
MYDATA MY 500 approved.
SOLDER PELLETS
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For wave soldering
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For selective soldering
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For rework & repair
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For pre-tinning
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For dipping
Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.
Interflux® Solder Pellets are small pieces of solder for easy solder bath filling in lead-free and SnPb(Ag) alloys.
Size: 1cm x 1cm approx.
IPA/DI WIPES
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ESD-safe
Interflux® pre-saturated IPA/DI wipes in flip-top tubs and refill bags for general cleaning of surfaces.
Interflux® pre-saturated IPA/DI wipes in flip-top tubs and refill bags for general cleaning of surfaces.
lint-free, non woven fabric
single wipe size: 15 x 21cm
100 pcs/ roll
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CONTACT
INTERFLUX
HEADQUARTERS
INTERFLUX
HEADQUARTERS
Interflux Electronics NV
Gent zeehaven 3170A
Eddastraat 51
9042 Gent
BELGIUM
Tel.: +32 9251 4959
Fax: +32 9251 4970
info@interflux.com
CONTACT
INTERFLUX WORLDWIDE
INTERFLUX WORLDWIDE
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